The Challenge

As part of an upgrading and refurbishment project at a semiconductor factory, the client required extensive demolition and modification works. Multiple partition rooms had to be removed to create a larger, open space, while various coring, slab openings, and drain modifications were also needed. The client also requested to complete the job within the given timeline.

Our Approach & Result

To deliver the scope, our team combined Bumblebee robotic hacking, diamond floor sawing, diamond wall sawing, and diamond concrete coring for this project. By combining advanced equipment with skilled operators, we ensured the works were completed safely, on time, and with clean finishes suitable for the factory’s next phase of refurbishment.

• 10 walls demolished using Bumblebee (robotic hacking), transforming multiple small partition rooms into one large open space
• Coring works through reinforced concrete walls, up to 250mm thick, for utility and service openings
• 10 slab cuttings of approximately 4m² each, with thicknesses ranging from 200mm to 400mm
• Scupper drain works, involved 13m cutting for new drainage alignment

Refurbishment in operational facilities demands a balance of speed, accuracy, and safety. Especially in environments as sensitive as a semiconductor factory.

In this project, the client needed to transform multiple small partition rooms into one large open space. Using our Bumblebee robotic hacking machine, we demolished 10 walls efficiently and with minimal vibration, reducing risks to the surrounding structure.

Once the partitions were cleared, we moved on to structural modifications. Our team executed coring works through 250mm reinforced concrete walls, followed by 10 slab cuttings of around 4m² each, ranging in thickness from 200mm to 400mm. These works allowed for new utility installations and service access required for the factory’s upgrade.

Finally, we carried out scupper drain hacking and cutting over a total length of 13m, ensuring proper drainage alignment for the refurbished space.

By leveraging a mix of robotic hacking, floor sawing, wall sawing, and precision coring, we delivered the complete scope on schedule and to the client’s specifications. The result was a fully prepared, open-plan factory space ready to support the next phase of semiconductor production upgrades.